A review of the use of adhesives for device assembly, focusing on optical radiation curing using UV light. by B. G. Yacobi, Chris Le Conte, Kevin Davis, and Manfred Hubert New equipment, such as the ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...