TweakTown

SK hynix CEO announces new vision as Full Stack AI Memory Creator: custom HBM, AI DRAM, AI NAND

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
TweakTown

SK hynix shows off HBM3E 12-Hi chips: 12 chips stacked, 40% thinner than 8-Hi stacks for 2025

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...
Semiconductor Engineering

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
Network World

Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Digi Times

GMIF2025: Samsung Semiconductor: Unlocking the Boundless Potential of the AI Era with Full-Stack Memory Innovation

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...